This Month’s Issue

Included in the October 2016 issue of MMI:

Cover story

Developments in Advanced Packaging Lead to a New Generation of Suppliers

  • As the Internet of Things (IoT) becomes increasingly common, there is an emerging trend in favor of “module manufacturing,” which includes IC packaging and compound semiconductor assembly. The recent success of system-in-package (SiP) and multichip module (MCM) solutions is leading top-tier EMS and ODM companies to explore alliances with IC packaging and optoelectronics firms.

Other articles in MMI

         Huawei and Flex to Start Making Phones in India

         Fabrinet Acquires UK’s Exception EMS 

         Samsung Selling Printing Business Unit to HP

         Apple Sets Up First R&D Center in China

         BlackBerry No Longer Building Phones; Switches to OEM Model

         Foxconn Installs 40,000 Robots at Factories  

        Pegatron to Make Microsoft’s New Surface PC Products

        Foxconn’s Sharp to Spend $570 Million on OLED Panel Production

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